In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of ...

In 3D integrated circuit (3D-IC) vertical stacked-die architecture, individual die are connected directly by Through-Silicon-Vias (TSVs) and micro-bumps. Simulation of 3D-ICs for power integrity needs ...

To address this challenge, Siemens’ Calibre 3DStress supports accurate, transistor-level analysis, verification, and debugging of thermo-mechanical stresses and warpage in the context of 3D IC ...

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

Cadence’s Clarity 3D Solver is designed to tackle EM challenges when designing complex 3D structures on chips, interposers, packages, PCBs, connectors, and cables, providing near-field finite element ...

Siemens Digital Industries Software announced the duo at DAC 2025. The Innovator3D IC suite advances 3D IC integration using AI to execute chip design and raise productivity, as designers increasingly ...

†The next level of chip integration is rapidly evolving, and 3D IC technology is poised to enable the next frontier of IC capabilities for customers under various deployment models.†said Shim Il ...

HFSS-IC Pro is certified for modeling on-chip electromagnetic integrity in radio frequency chips, WiFi, 5G/6G, and other telecommunication applications made with the Intel 18A process node.