An example of this with the foundational interposer model is shown below. Fig. 5: EM wave propagation in foundational interposer model (HFSS 3D Layout). The final step for design sign-off employs HFSS ...

In 3D integrated circuit (3D-IC) vertical stacked-die architecture, individual die are connected directly by Through-Silicon-Vias (TSVs) and micro-bumps. Simulation of 3D-ICs for power integrity needs ...

You can join the discussion at the links below. Stay tuned for more information in 2023. Comprehensive Multiphysics Analysis Platform for 3D-IC Interposers The Challenge of Electromagnetic Modeling ...

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

It enables IC designers to efficiently author, simulate and manage heterogeneously integrated 2.5D/3D IC designs with a fast, predictable path for planning and heterogeneous integration, ...

Cadence is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node silicon designs and 3D-ICs.

†The next level of chip integration is rapidly evolving, and 3D IC technology is poised to enable the next frontier of IC capabilities for customers under various deployment models.†said Shim Il ...

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs.