The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

Integrated Fan Out (InFO) 2.5D-IC and 3D-IC What are 2.5D and 3D-ICs? As consumption of everything digital continues to put pressure on devices to be faster, smarter, and smaller, the need for ICs to ...

June 24, 2025 -- Siemens Digital Industries Software today introduced two new solutions to its Electronic Design Automation (EDA) portfolio that help semiconductor design teams address and overcome ...

The Innovator3D IC solution suite has been developed to enable IC designers to author, simulate and manage heterogeneously integrated 2.5D/3D IC designs more efficiently. In addition, Siemens’ new ...

As the semiconductor industry strives to pack more functionality into smaller spaces, 2.5D and 3D integrated circuits (3D ICs) have emerged as a transformative technology. 2.5D ...

A new technical paper titled “DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design” was published (preprint) by researchers at UCSB and Cadence. Abstract “Thermal issue is ...

Plano, Texas, USA -- April 29, 2025 -- Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated ...

"ESD protection and core circuit co-design are increasingly important in advanced ICs, but conventional diode models do not account for ESD event regimes, during which the device operates under ...