Such defects can lead to shorts, interference between neighboring memory strings, and other performance issues.” [4]. Stacking several decks of memory arrays (e.g. 2 decks of 64-layers to provide an ...

Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.

A new technical paper titled “Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In ...

In a development that the company claims could meet a future demand for higher density NAND flash memory, at the VLSI Symposium in Japan today Toshiba Corp. announced a new three-dimensional memory ...

Toshiba’s BG3 series leverages the Host Memory Buffer (HMB) feature in NVMe Revision 1.2.1 to maintain high performance without integrated DRAM by using host memory for flash management purposes.

The new 3D flash memory technology is the eighth-generation BiCS FLASH, which reportedly has the industry's highest bit density owing to its 218-layer 3D flash that leverages 1Tb triple-level-cell ...

This sixth-generation 3D flash memory features advanced architecture beyond conventional eight-stagger memory hole array and achieves up to 10% greater lateral cell array density compared to the ...