Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap ...

Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.

In a development that the company claims could meet a future demand for higher density NAND flash memory, at the VLSI Symposium in Japan today Toshiba Corp. announced a new three-dimensional memory ...

The new 3D flash memory technology is the eighth-generation BiCS FLASH, which reportedly has the industry's highest bit density owing to its 218-layer 3D flash that leverages 1Tb triple-level-cell ...

Toshiba’s BG3 series leverages the Host Memory Buffer (HMB) feature in NVMe Revision 1.2.1 to maintain high performance without integrated DRAM by using host memory for flash management purposes.