Built on Micron’s 1-beta DRA M process and utilizing its established packaging technology, the HBM4 memory features a 2048-bit interface and speeds exceeding 2.0 terabytes per second per memory ...

SK Hynix is on the home stretch for mass production of the blazing fast HBM4 stack memory for Nvidia's next generation Rubin accelerator. (Image: SK Hynix) May 29, 2025 at 8:49 pm CEST 3 min. read ...

The Korean corporation is expected to finalize the SAINT-D process this year, with HBM4 memory technology arriving next year. Companies developing AI accelerators, particularly Nvidia, are Samsung ...

The process forecasts memory packages that are faster, smaller, and consume less power. For example, using the TSV 2-Gb DRAMs, the company can create a 4-GB DIMM based on advanced WSP technology.