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For the latest release MiDaS 3.1, a technical report and video are available. MiDaS was trained on up to 12 datasets (ReDWeb, DIML, Movies, MegaDepth, WSVD, TartanAir, HRWSI, ApolloScape, BlendedMVS, ...
Key Laboratory of Fine Petro-chemical Technology, Jiangsu Polytechnic University, Changzhou 213164, People’s Republic of China, College of Chemistry, Chongqing Normal University, Chongqing 400047, ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite ... thermal stress ...
† State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing, 210096, P. R. China ‡ Department of Physics, Southeast University, ...
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