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From spacecraft engineers to open-source rebels, these innovative women are changing the face of what engineering looks like, ...
Industrial Automation Brings Animatronic Robot Alive . Science fiction, particularly in movies featuring robots like R2-D2 ...
This annual awards celebrates the products exhibited at ISTELive that are transforming education in schools around the world.
Fresh produce is the star of the Halls Crossroads Women's League farmers market, which will be held every Saturday through Oct. 4. Knoxville-area residents traveling into Western North Carolina might ...
Tiangong, developed by the Beijing Humanoid Robot Innovation Center, is the world’s first fully electric running humanoid, and it’s open-source. Launched in April 2024 and open-sourced by late 2024, ...
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Tech Xplore on MSNEngineers create first AI model specialized for chip design languageResearchers at NYU Tandon School of Engineering have created VeriGen, the first specialized artificial intelligence model ...
A new technical paper titled “QiMeng: Fully Automated Hardware and Software Design for Processor Chip” was published by researchers at Chinese Academy of Sciences. Abstract “Processor chip design ...
While 3D printers aren't yet up to the task of printing such a fine-scale and dense network, the researchers were able to design and print a vascular model with 500 branches.
It’s Independence Day here in the USA, but if you’re not a fan of fireworks and hot dogs, Elliot and Dan’s rundown of the best hacks of the week is certainly something to ...
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Interesting Engineering on MSNBerkeley unveils customizable humanoid robot built from 3D-printed partsBerkeley unveils a $5K open-source humanoid robot built from 3D-printed parts, empowering anyone to learn, build, and customize robotics.
HP has revealed the first third-party hardware built using Google’s 3D video conferencing technology, Beam. The HP Dimension costs $24,999 and features a 65-inch light field display to create a ...
ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged ...
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