Raspberry Pi launched a follow-up to its Camera Module 3 with the Camera Module 3 Sensor Assembly. Now, Raspberry Pi users can put the camera sensors into their own custom form factors.

FRAMOS is due to release the first image sensor module and development kit on the market for Sony's new high-resolution IMX811 image sensor with 247 megapixels.

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Automotive electronics typically operate in high-temperature environments with significant electrostatic interference, which increases the reliability requirements for on-chip electrostatic discharge ...

Sintered silver (Ag), as the most promising chip interconnect material for high-temperature silicon carbide (SiC) power module packaging, is often subjected to thermal stress during the packaging ...