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Hi, I'm Bill. I'm a software developer with a passion for making and electronics. I do a lot of things and here is where I ...
used in sensor interface circuits for IoT. TFET's steep subthreshold slope characteristics enable designing high throughput and energy efficient transceiver circuits for 3D IC and sensor interface TDC ...
Abstract: While the ultimate goal of Cu interconnection in 3D-IC is to have Cu as both the glue layer and interconnection line, there has been numerous demonstration of Cu-Cu bonding that shows the ...