Since Java 21, wrapper classes have played an increasingly sophisticated role in Java’s type system. Here’s everything you ...

A general approach has been proposed for predicting the temperature and thermal stress fields of through-silicon-via (TSV) arrays in 3-D integrated circuits (ICs) based on a coupled-field ...

Support is available to assist with incorporating StAEDI into your business's application. Available services include Development of EDI validation schemas using your documentation (e.g. PDF) ...

Start with the basics: get a handle on what AI is, why it matters, and how it’s used in the real world. Make a plan: figure ...

The development of a chip-based sensor array composed of individually addressable polystyrene−poly(ethylene glycol) and agarose microspheres has been demonstrated. The microspheres are selectively ...