SK Hynix is on the home stretch for mass production of the blazing fast HBM4 stack memory for Nvidia's next generation Rubin accelerator.

While processor speeds and memory storage capacities have surged in recent decades, overall computer performance remains constrained by data transfers, where the CPU must retrieve and process data ...

Meet Memoripy: A Python library that brings real memory capabilities to AI applications. Memoripy addresses the problem of maintaining conversational context by equipping AI systems with structured ...

Hardware Industry samsung 3d packaging Samsung plans to stack HBM memory on top of CPUs and GPUs arriving in 2025 SAINT-D vertical stacking technology ready just in time for HBM4 debut next year ...

Thermal becomes a major problem for all such memory layers. “You typically have the processor on the bottom and the memory die above it,” says John Parry, industry director for Electronics & ...

Micron has now entered the HBM3 race with what the company calls a “second-generation” HBM3 design, based on a faster, denser, more advanced semiconductor process node.