Novel compact optical backplane connectors with 2-D arranged inputs/outputs (I/Os) are demonstrated. To meet the requirement of higher integration in an optical backplane system, we applied 3-D ...

The capability of assembling nanoparticles into a desired ordered pattern is a key to realize novel devices which are based not only on the unique properties of nanoparticles but also on the ...

A general approach has been proposed for predicting the temperature and thermal stress fields of through-silicon-via (TSV) arrays in 3-D integrated circuits (ICs) based on a coupled-field ...