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2.5D silicon interposer packages have been widely adopted for high-end applications such as datacenter, networking, and artificial intelligence. To meet the increasing demand for higher performance ...
Sintered bonding technology will be required to achieve higher thermal conductivity and higher joint reliability for power package and power module application. Several characteristic sintered ...
RubyGems and PyPI hit by credential-stealing packages targeting automation and crypto users, prompting new security rules.
Malicious PyPI packages, repo hijacks, and CVEs in Python containers put devs at risk. Learn how to stay secure.
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