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Unveiled at the nonprofit’s APAC Summit in Taiwan, the Universal D2D Transaction and Link-Layer specification is designed to ...
LPDDR6; hardware root of trust; PCB crosstalk; structured design data; multiphysics for multi-die; IoT shifts; Scope 3 ...
Lack of security metrics, and the increasing adoption of chiplets, 2.5D architectures, and AI all complicate security.
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