The industry’s current enthusiasm for 3D-ICs is widespread and well warranted, but designing those 3D devices presents a challenge. Normal 2D tool flows, thoroughly honed and refined over many years ...

The time of 3D integrated circuits (3D ICs) is here, and they will revolutionize the semiconductor industry and effect a watershed in the nature of electronics products that can be designed and ...

Siemens and Intel Foundry collaborate for ICs and advanced packaging solutions for 2D- and 3D-IC Siemens is a founding partner of the Intel Foundry Accelerator Chiplet Alliance – enabling a new and ...

Additional challenges for automating ESD verification in 2.5D/3D ICs Automating ESD verification in 2.5D/3D ICs introduces additional challenges that we don’t see in 2D “traditional single die” ICs.

A new graphene-based interconnect technology developed by Destination 2D promises to help ICs overcome the limitations imposed by today’s copper-based processes.

Understanding the thermal challenges in 3D ICs The shift from traditional 2D IC designs to 3D ICs brings a new set of thermal dynamics.