The time of 3D integrated circuits (3D ICs) is here, and they will revolutionize the semiconductor industry and effect a watershed in the nature of electronics products that can be designed and ...

The industry’s current enthusiasm for 3D-ICs is widespread and well warranted, but designing those 3D devices presents a challenge. Normal 2D tool flows, thoroughly honed and refined over many years ...

The shift from traditional 2D IC designs to 3D ICs brings a new set of thermal dynamics. ... such as timing and power analysis, ... Energy Harvesting with the MAX17710.

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University. Abstract ...

Siemens Digital Industries Software announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional ...

What you’ll learn: A new process for creating interconnects on ICs using high-conductivity 2D graphene films could enable production of smaller, faster, cooler-running devices than those using ...