Key technologies like 3D stack memory and advanced platforms such as CBA DRAM, 3D SoC, and 3D NAND are pivotal in meeting modern electronics' performance, power, and miniaturization needs ...

However, if somehow you can develop interlayer cooling within the stack, then all of a sudden there’s an opportunity to really bring down the temperatures to around 50°C,” according to imec’s 3D stack ...

3D stack memory technologies-including HBM, 3DS, 3D NAND, and CBA DRAM-are key growth drivers. The fastest-growing platforms include CBA DRAM, 3D SoC, active silicon interposers, 3D NAND stacks ...

Key technologies like 3D stack memory and advanced platforms such as CBA DRAM, 3D SoC, and 3D NAND are pivotal in meeting modern electronics' performance, power, and miniaturization needs.

Python version 3.7 or higher Zivid SDK version 2.16.0 (see here for help) Compiler with C++17 support Ubuntu users must install Python headers (apt install python3-dev) in addition to the regular ...

This paper presents a 3D integration concept as a solution to package FBAR or BAW devices providing at the same time additional RF functionality. The feasibility of this 3D packaging solution has been ...

A pure Python 2D/3D graphics library that outputs to windows bitmap format Developed and tested using Python 3.8 / 3.10.4 / 3.11 / 3.12 No dependencies required YouTube Playlist PyPI ...