3D stacked devices have been developed and manufactured to realize gains in power, performance, area and cost (PPAC) in various devices. In this work, CMOS directly bonded to array (CBA) technology is ...

Here we report for the first time mid IR OPO with LGS. The sample was only 8.2 mm long, with an aperture of 5 mm (along Z-axis) x 7 mm. It was cut at θ=90°, φ=40.6° for eo-e type-II phase-matching in ...