A general approach has been proposed for predicting the temperature and thermal stress fields of through-silicon-via (TSV) arrays in 3-D integrated circuits (ICs) based on a coupled-field ...

Is your feature request related to a problem? Please describe. Currently, the ADK lacks built-in functionality to iterate over arrays and pass each element to sub-agents. While we have LoopAgent (runs ...

In this letter, the phenomenon of extraordinary transmission through arrays of subwavelength holes in the microwave range is demonstrated. It is also shown that the magnitude of the transmission is ...