Multi-dies stack 3D-ICs are an extension of traditional 2-dies 3D-ICs to address the memory wall and footprint problems. This paper presents a complete Place-and-Route (PnR) flow to enable 3-dies ...

Leia launches Immersity, a free mobile app that turns photos into dynamic 3D reels using AI, bringing immersive content ...

A Design-for-test (DfT) technique is proposed in this paper for a test method, by which detecting open defects occurring interconnects between 3D stacked SRAM IC and a printed circuit board and among ...