Multi-dies stack 3D-ICs are an extension of traditional 2-dies 3D-ICs to address the memory wall and footprint problems. This paper presents a complete Place-and-Route (PnR) flow to enable 3-dies ...

Leia launches Immersity, a free mobile app that turns photos into dynamic 3D reels using AI, bringing immersive content ...

Computational image sensors with CNN processing capabilities are emerging to alleviate the energy-intensive and time-consuming data movement between sensors and external processors. However, deploying ...

AnyChart is a lightweight and robust JavaScript charting solution with great API and documentation. The chart types and unique features are numerous, the library works easily with any development ...

SK Hynix has unveiled a long-term roadmap for next-generation DRAM technologies, laying out a vision that aims to drive sustainable innovation over the next 30 years as the global semiconductor ...

“HBM4 represents the latest advancement in 3D-stacked DRAM technology, offering major gains in bandwidth, density, and efficiency tailored for AI and high-performance computing.