Solid-state insertion bonding utilizing nanotwinned copper micro-cone array (nt-Cu MCA) was regarded as a potential solution to the vertical interconnection of chips. It is widely acknowledged that ...

This paper proposes design of a 10-bit Successive Approximation Register (SAR) Analog to Digital Converter (ADC) reducing device mismatching property driven by MSB node of C-DAC array divided into 4 ...