Dr. James McCaffrey presents a complete end-to-end demonstration of the kernel ridge regression technique to predict a single ...

This study focuses on the more efficient packaging reliability prediction by considering cluster analysis and regression algorithm simultaneously. The Wafer Level Chip Scale Packaging (WLCSP) ...

Due to the advent of deep sub-micron technologies, statistical (in addition to temperature and supply voltage) variations aware estimation of leakages power has become prominent. Also, estimation of ...